John Lau

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John Lau (1981- ) A nature lover from Hong Kong.

He have studied in nature since 1990.

From shore and nature creatures and studied indoor.

Studied about crabs, shrimps, fish, insects and plants.

He made in first Chinese nature book 生物小教室 in 2016

He wrote and publish the Amazon kindle ebook -

Robot kids book

Robot kids book 2*

*Got No.1 Best New Tinkered Books in 2019

Got No.1 Best New Tinkered Books in 2020

Best New Tinkercad eBooks To Read In 2020-2023

No. 8 of Best Tinkercad Books in All Time

No. 8 Best Selling Tinkercad Book in All Time

(Awarded from Book Authority)

https://bookauthority.org/books/new-tinkercad-books

機械人小教室

Little creatures classroom 2

DIY kids book

DIY kids book 2

in 2019

eco corner kidforum fb

http://www.z-life.info

https://zlifekidstech.freeforums.net/

http://www.facebook.com/ecocornerkidforum

https://www.youtube.com/channel/UCYt4ydwX7JDEUXgt7FLhtAA

http://www.instagram.com/ecocornerkidforum

http://www.adcardz.com/zlifekidstech

http://www.eco-corner.info

free books (4 days) every month, hope more people get these 3 books!

DIY kids book

DIY kids book 2

Little nature classroom 2

*263 ebooks gifted!

7308 pages read from Kenp

Keep it up!

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作者更新

DIY kids book 2019/3/10

John Lau

US$2.99

A book for kids to learn DIY

這本書和超過 100 萬本書任您挑選，盡在 Kindle Unlimited。

DIY kids book 2 2019/3/15

John Lau

US$2.99

DIY kids book, household repairing and kids diy projects

這本書和超過 100 萬本書任您挑選，盡在 Kindle Unlimited。

Thermal Stress and Strain in Microelectronics Packaging (Electrical Engineering) 2012/12/6

John Lau

( 2 )

US$23.74

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.

其他版本：: ,

機械人小教室 (Traditional Chinese Edition) 2019/7/20

John Lau

US$2.99

機械人小室, 一本介紹機械人基礎程式的書, 包括Micro bit, App inventor 2, Tinkercad, Arduino simulator

這本書和超過 100 萬本書任您挑選，盡在 Kindle Unlimited。

Robot kids book 2 2019/4/21

John Lau

US$2.99

Robot kids book 2 - A book for kids who want to learn robot, micro bit, app inventor 2, Arduino and tinkercad "One of the best new Tinkercad books" - BookAuthority

其他版本：: