- Hardcover: 428 pages
- Publisher: Springer; 2004 edition (March 19, 2004)
- Language: English
- ISBN-10: 3540431810
- ISBN-13: 978-3540431817
- Product Dimensions: 9.2 x 1.1 x 6.1 inches
- Shipping Weight: 2.2 pounds (View shipping rates and policies)
- Average Customer Review: 2 customer reviews
- Amazon Best Sellers Rank: #2,735,084 in Books (See Top 100 in Books)
Enter your mobile number or email address below and we'll send you a link to download the free Kindle App. Then you can start reading Kindle books on your smartphone, tablet, or computer - no Kindle device required.
To get the free app, enter your mobile phone number.
Chemical Mechanical Planarization of Semiconductor Materials 2004th Edition
Use the Amazon App to scan ISBNs and compare prices.
Fulfillment by Amazon (FBA) is a service we offer sellers that lets them store their products in Amazon's fulfillment centers, and we directly pack, ship, and provide customer service for these products. Something we hope you'll especially enjoy: FBA items qualify for FREE Shipping and Amazon Prime.
If you're a seller, Fulfillment by Amazon can help you increase your sales. We invite you to learn more about Fulfillment by Amazon .
The Amazon Book Review
Author interviews, book reviews, editors picks, and more. Read it now
Frequently bought together
Customers who viewed this item also viewed
Customers who bought this item also bought
From the Back Cover
This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Top customer reviews
There was a problem filtering reviews right now. Please try again later.
The book is well edited by Mike Oliver. It includes chapters written by well known CMP specialists that focus on process aspects (technology, equipment, pads, cleaning), on metals (theory and applications), on slurries, and on patterned wafers. It also provides chapters with overviews of CMP. Each chapter has extensive references.
The individual chapters are carefully written to offer an introduction and broad perspectives to new CMP workers while providing depth of insight and material for experienced practitioners. This is an ideal book for advanced undergraduates and graduate students who are working in the field and for those who are starting to do planarization of semiconductor materials. It is also an ideal reference book for experienced polishers since it gives information about the process at a level that is useful and insightful.
I have found the book very useful to me both for its clear summaries of material that I already know about and for its helpful explanations of areas that I am not familiar with. I highly recommend it.