This is lead-free, no-clean formula solder paste made specifically for leaded and lead-free rework and design. The 35 gram/10Cc syringe comes with a plunger and tip. The paste is 96.5 percent tin, 3 percent silver, and 0.5 percent copper.
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I’m a rookie, first time experimenting with smd soldering. Worked ok for me but nothing to compare it to. The chart on the back of the instruction card makes absolutely no sense. I have the SMD291SNL solder. Components self center on pads as soon as paste melts. Using hot air at 350c.
I could not get this paste to melt and flow, I followed the instructions and set my hot air station to the recommended temperature and nothing. I even set it to the highest temperature and all it did was dry out.