Chips 2020: A Guide to the Future of Nanoelectronics (The Frontiers Collection) Kindle Edition

5.0 out of 5 stars 1 customer review
ISBN-13: 978-3642223990
ISBN-10: 3642223990
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Editorial Reviews

Review

From the reviews: The book 's chapters provides an almost definitive list of hot topics and includes chapters on logic and computing, analog-digital interfaces, interconnects and transceivers power efficient design and energy harvesting and chip autonomy. It is suitable both for the student, researcher or recent graduate that wants to understand where the challenges lie in chips, and for experienced managers, investors and policy makers, who may have been looking at the trees for so long that they will now benefit from this look at the forest. (Peter Clarke, EETimes, February, 2012)

From the reviews: The book s chapters provides an almost definitive list of hot topics and includes chapters on logic and computing, analog-digital interfaces, interconnects and transceivers power efficient design and energy harvesting and chip autonomy. It is suitable both for the student, researcher or recent graduate that wants to understand where the challenges lie in chips, and for experienced managers, investors and policy makers, who may have been looking at the trees for so long that they will now benefit from this look at the forest. (Peter Clarke, EETimes, February, 2012)

From the reviews: The book s chapters provides an almost definitive list of hot topics and includes chapters on logic and computing, analog-digital interfaces, interconnects and transceivers power efficient design and energy harvesting and chip autonomy. It is suitable both for the student, researcher or recent graduate that wants to understand where the challenges lie in chips, and for experienced managers, investors and policy makers, who may have been looking at the trees for so long that they will now benefit from this look at the forest. (Peter Clarke, EETimes, February, 2012)"

From the Back Cover

The chips in present-day cell phones already contain billions of sub-100-nanometer transistors. By 2020, however, we will see systems-on-chips with trillions of 10-nanometer transistors. But this will be the end of the miniaturization, because yet smaller transistors, containing just a few control atoms, are subject to statisticalfluctuations and thus no longer useful. We also need to worry about a potential energy crisis, because in less than five years from now, with current chip technology, the internet alone would consume the total global electrical power!

This book presents a new, sustainable roadmap towards ultra-low-energy (femto-Joule), high-performance electronics. The focus is on the energy-efficiency of the various chip functions: sensing, processing, and communication, in a top-down spirit involving new architectures such as silicon brains, ultra-low-voltage circuits, energy harvesting, and 3D silicon technologies. Recognized world leaders from industry and from the research community share their views of this nanoelectronics future. They discuss, among other things, ubiquitous communication based on mobile companions, health and care supported by autonomous implants and by personal carebots, safe and efficient mobility assisted by co-pilots equipped with intelligent micro-electromechanical systems, and internet-based education for a billionpeople from kindergarden to retirement. This book should help and interest all those who will have to make decisions associated with future electronics: students, graduates, educators, and researchers, as well as managers, investors, and policy makers.

Introduction: Towards Sustainable 2020 Nanoelectronics.- From Microelectronics to Nanoelectronics.- The Future of Eight Chip Technologies.- Analog Digital Interfaces.- Interconnects and Transceivers.- Requirements and Markets for Nanoelectronics.- ITRS: The International Technology Roadmap for Semiconductors.- Nanolithography.- Power-Efficient Design Challenges.- Superprocessors and Supercomputers.- Towards Terabit Memories.- 3D Integration for Wireless Multimedia.- The Next-Generation Mobile User-Experience.- MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer.- Vision Sensors and Cameras.- Digital Neural Networks for New Media.- Retinal Implants for Blind Patients.- Silicon Brains.- Energy Harvesting and Chip Autonomy.- The Energy Crisis.- The Extreme-Technology Industry.- Education and Research for the Age of Nanoelectronics.- 2020 World with Chips."


Product Details

  • File Size: 12300 KB
  • Print Length: 477 pages
  • Publisher: Springer; 2012 edition (December 15, 2011)
  • Publication Date: December 15, 2011
  • Sold by: Amazon Digital Services LLC
  • Language: English
  • ASIN: B007EM6JSY
  • Text-to-Speech: Enabled
  • X-Ray:
  • Word Wise: Not Enabled
  • Lending: Not Enabled
  • Enhanced Typesetting: Not Enabled
  • Amazon Best Sellers Rank: #2,578,395 Paid in Kindle Store (See Top 100 Paid in Kindle Store)
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Top Customer Reviews

Format: Hardcover
Early in the 90's I had the pleasure to collaborate with Hoefflinger, who at that time was the director of the Institute for Microelectronics Stuttgart (IMS CHIPS). I was the CEO of Chip Express then and we worked together to demonstrate that applying Direct-Write-eBeam to a Chip Express wafer could lead to a very effective Gate-Array prototyping scheme and to low volume production of those Gate-Arrays.

It was great pleasure to reconnect and to read "Chip 2020"
I highly recommend this book as it provides an update view of the Semiconductor Industry by a group of known experts in our field.
The book provides a concise review how we got here and what is ahead for us up to the year 2020.

The book presents a now more common view that the scaling that got us here is gone, and that there are concrete red-bricks for dimensional scaling beyond 2020. Primarily:

1. As gate sizes reach ~10nm we would have nominally 6 atoms of impurity in the channel with a commensurate variation that would constrain effective use of the transistor -see Fig. 1.1

2. As lithography tools are already forced to use double exposure/processing it has became unclear if an effective lithography is going to be available to move forward. See the Table 8.3 below, provided by Burn J. Lin of TSMC
Picture
Clearly the future cost of lithography eats away at the cost advantage of dimensional scaling.

Hoefflinger presents some options to tackle these challenges as detailed through the book and with respect to specific segments of the industry. The following Fig. 3.1 presents these future technologies:

At MonolithIC 3D we were pleased to see the important role given to 3D IC in the book as shown in the Fig. 3.
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