Electronic Packaging and Interconnection Handbook 4/E 4th Edition

by Charles A. Harper (Author)

1 customer review

ISBN-13: 978-0071430487

ISBN-10: 0071430482

Why is ISBN important?

Have one to sell? Sell on Amazon

Added to

Unable to add item to List. Please try again.

Condition: Used - Good

In Stock. Sold by idaho_youth_ranch_books

Access codes and supplements are not guaranteed with used items.

27 Used from $56.29

+ $3.99 shipping

Select delivery location

Turn on 1-Click ordering

Only 1 left in stock (more on the way).

Ships from and sold by Amazon.com. Gift-wrap available.

This item ships to France. Want it Monday, April 9? Order within and choose AmazonGlobal Priority Shipping at checkout. Learn more

List Price: $206.00 Save: $84.89 (41%)

20 New from $121.09

Select delivery location

Turn on 1-Click ordering

More Buying Choices

20 New from $121.09 27 Used from $56.29

47 used & new from $56.29

See All Buying Options

Free%20Two-Day%20Shipping%20for%20College%20Students%20with%20Amazon%20Student

Electronic packaging is the underlying technology behind the creation of small electronic devices such as cell phones, PDAs, and laptops. Packaging advances in this field have driven the miniaturization of consumer electronics. This is THE standard reference in the field, nearly 75% rewritten to reflect the tremendous advances that have taken place in the past five years. Contents: Fundamental Technologies; Materials for Electronic Packaging; Thermal Management of Electronic Packages; Shock,Vibration, and Operational Stress Management;Connector and Interconnections Technologies; Soldering and Cleaning Technologies * Packaging and Interconnection Technologies; Single Chips Packaging and Ball Grid Arrays; Surface Mount Technology; Hybrid and Multichip Module Packaging; Chip Scale, Flip Chip, and Direct Chip Attachment,Rigid and Flexible Printed Wiring Boards * System Packaging Technologies; Packaging High Speed and Microwave Systems; Packaging High Voltage Systems; Packaging of MEMs Systems; Packaging of Optoeletronic Systems

Customers who viewed this item also viewed

Page 1 of 1 Start overPage 1 of 1

This shopping feature will continue to load items. In order to navigate out of this carousel please use your heading shortcut key to navigate to the next or previous heading.

Charles A. Harper

2

Hardcover
15 offers from $15.77
Richard K. Ulrich

4

Hardcover
$116.96
John H. Lau
Hardcover
19 offers from $20.71
MEI )HA PO JIA…
Paperback
2 offers from $94.68
Andrea Chen

2

Hardcover
$80.00
Robert J. Hannemann
Paperback
11 offers from $39.99

Customers who bought this item also bought

Page 1 of 1 Start overPage 1 of 1

This shopping feature will continue to load items. In order to navigate out of this carousel please use your heading shortcut key to navigate to the next or previous heading.

James Valentino
Paperback
$79.95

What other items do customers buy after viewing this item?

Electronic Packaging and Interconnection Handbook Hardcover

Charles A. Harper

2
15 offers from $15.77
WIRE BONDING IN MICROELECTRONICS, 3/E Hardcover

George Harman

7

$96.24
Advanced Electronic Packaging Hardcover

Richard K. Ulrich

4

$116.96
Fundamentals of Microsystems Packaging Hardcover

Rao Tummala

2

$127.17

Editorial Reviews

Review

Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as "Handbook of Electronic Packaging," the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies..

From the Back Cover

THE MOST COMPREHENSIVE REFERENCE IN ELECTRONIC PACKAGING―COMPLETELY UPDATED

From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry. This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies.

Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others.

Whether your area of expertise is design and manufacturing, quality control, or marketing, it's easy to see why the Fourth Edition of the Electronic Packaging and Interconnection Handbook makes an excellent addition to your reference arsenal.

Written by a team of experts from around the globe, this remarkable volume covers all aspects of electronic packaging, including:

Materials
Thermal Management
Shock, Vibration, and Operational Stress Management
Connector and Interconnection Technologies
Soldering and Cleaning Technologies
Single Chip Packaging and Ball Grid Arrays
Surface Mount Technology
Hybrid and Multichip Modules
Chip-Scale, Flip-Chip, and Direct-Chip Attachment
Rigid and Flexible Printed-Wiring Boards
Packaging High-Speed and Microwave Systems
Packaging High-Voltage Systems
Packaging of MEMs Systems
Packaging of Optoelectronic Systems

See all Editorial Reviews

Product details

Hardcover: 1000 pages
Publisher: McGraw-Hill Education; 4 edition (October 19, 2004)
Language: English
ISBN-10: 0071430482
ISBN-13: 978-0071430487
Product Dimensions: 7.3 x 2.8 x 9.5 inches
Shipping Weight: 4.1 pounds (View shipping rates and policies)
Average Customer Review: 1 customer review
Amazon Best Sellers Rank: #1,924,845 in Books (See Top 100 in Books)
- #90 in Books > Engineering & Transportation > Engineering > Industrial, Manufacturing & Operational Systems > Industrial Design > Packaging
- #300 in Books > Engineering & Transportation > Engineering > Electrical & Electronics > Electronics > Semiconductors
- #5586 in Books > Engineering & Transportation > Engineering > Telecommunications & Sensors

Would you like to tell us about a lower price?
If you are a seller for this product, would you like to suggest updates through seller support?

NO_CONTENT_IN_FEATURE

Important information

Ingredients

Example Ingredients

Directions

Example Directions

Customer Reviews

1.0 out of 5 stars

5 star (0%)

4 star (0%)

3 star (0%)

2 star (0%)

1 star

Write a customer review

See all 1 customer reviews

Rated by customers interested in

What's this?

Digital Photography

1.0 out of 5 stars

Organic Food

1.0 out of 5 stars

Sunglasses

1.0 out of 5 stars

Is this feature helpful?

Thank you for your feedback.

Top customer reviews

There was a problem filtering reviews right now. Please try again later.

The book has several weaknesses that do not justify its ...

November 4, 2017

Format: HardcoverVerified Purchase

The book has several weaknesses that do not justify its price.
- Some of the materials are years behind the publishing date of this book. Hence, despite the more current publishing date, its material is not more up-to-date than the older book "Microelectronics Packaging Handbook" by R. Tummala et al.
- Unlike the book by Tummala, each chapter is written by a single author only. Hence it is more prone to mistakes. For example, the typo errors in the equations sometimes make the materials confusing. For the same reason, the coverage of each chapter seems superficial
And so, the lack of an up-to-date and reliable microelectronics packaging book continues ...

CommentWas this review helpful to you?

Yes

Set up an Amazon Giveaway

Amazon Giveaway allows you to run promotional giveaways in order to create buzz, reward your audience, and attract new followers and customers. Learn more about Amazon Giveaway

This item: Electronic Packaging and Interconnection Handbook 4/E

Set up a giveaway

Pages with related products. See and discover other items: electronics communications, packaging design

Electronic Packaging and Interconnection Handbook 4/E 4th Edition

Sorry, there was a problem.

Sorry, there was a problem.

Buy used On clicking this link, a new layer will be open $56.29 On clicking this link, a new layer will be open

Turn on 1-Click ordering

Buy new On clicking this link, a new layer will be open $121.11 On clicking this link, a new layer will be open

Turn on 1-Click ordering

Customers who viewed this item also viewed

Customers who bought this item also bought

What other items do customers buy after viewing this item?

Editorial Reviews

Review

From the Back Cover

Product details

Important information

Ingredients

Directions

Customer Reviews

Top customer reviews

There was a problem filtering reviews right now. Please try again later.

Set up an Amazon Giveaway

Buy used On clicking this link, a new layer will be open

$56.29 On clicking this link, a new layer will be open

Buy new On clicking this link, a new layer will be open

$121.11 On clicking this link, a new layer will be open