- Series: Topics in Applied Physics (Book 78)
- Hardcover: 416 pages
- Publisher: Springer; 2000 edition (October 13, 2000)
- Language: English
- ISBN-10: 3540666931
- ISBN-13: 978-3540666936
- Product Dimensions: 6.1 x 1 x 9.2 inches
- Shipping Weight: 1.6 pounds (View shipping rates and policies)
- Average Customer Review: 2 customer reviews
- Amazon Best Sellers Rank: #3,943,476 in Books (See Top 100 in Books)
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High-Power Diode Lasers: Fundamentals, Technology, Applications (Topics in Applied Physics) 2000th Edition
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From the Back Cover
Methods of design and fabrication of high-power diode lasers using proven semiconductor technologies are presented in a comprehensive fashion making this book an invaluable source of information for all scientists and engineers designing laser systems and applying the laser as a reliable and economic tool in a multitude of environments. It summarizes the prerequisites to set up state-of-the-art high-power diode-laser sources and how to use them in various applications. The available information, until now scattered worldwide in the scientific and technical literature, has been collected and compiled by the authors to give a complete overview of the principles of high-power diode lasers and design aspects for achieving high optical output power at high efficiency, low threshold current density, high reliability, and for reducing production costs. Special features are the development of high-brightness diode lasers for application in direct materials processing, technologies of alloying single lasers and laser bars to sophisticated heat sinks and direct applications of high-power diode-laser systems with coherent and incoherent beam combining and also new concepts for diode-pumped solid-state lasers such as the fiber laser and the disc laser which become feasible through diode pumping.
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Top customer reviews
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I am surprised that such various details are coverd in this book. Compared with some other books where the design and physics for high power laser are addressed, this book appears to provide more details for readers. The authors are writing their own experience, which I believe it very valuable. The important parameters which the industry people care about, are explained and described, such as facet coating, heat dissipation and device package, which I thought the authors may write more about.
Since the materials in this book provide far beyond physics and device design, it is sure to be welcomed from both the industry and the universities where the intense research is under the way.