- Product Dimensions: 0.8 x 0.8 x 0.8 inches
- Shipping Weight: 3.2 ounces (View shipping rates and policies)
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- ASIN: B00M1RC0YY
- Item model number: 4860P-35G
- Average Customer Review: 96 customer reviews
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MG Chemicals 4860P-35G 63/37 No Clean, Leaded Solder Paste, 35 g (1.2 oz) Syringe
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- No Clean Flux
- Easily Dispensed
- Excellent Wettability
- Ideal for surface mount applications
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From the manufacturer
4860P—Sn63/Pb37 No Clean Solder Paste T3
Designed for surface mount applications and provides high tack force and good wettability and high speed printing. It can yield brick-like prints even when using an ultra-fine pitch stencils down to 0.3 mm. Available in a 35 g syringe, 250 g and 500 g jar.
M.G. Chemicals Leaded, No Clean Solder Paste is made from a blend of virgin high purity non-recycled Tin and Lead metal powder blended with a No Clean flux to form a paste. Designed for surface mount applications using a syringe dispensing method, it provides high tack force and good wettability. The post soldering transparent residues are non-conductive, non-corrosive and highly insulated. The name no clean refers to the fact that the flux residues are not harmful to assemblies and does not mean there will be no residues.
Size: 1.2 oz
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Top customer reviews
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-Plunger pressure is minimal, and it is easy to reseal the container. You can tell that MG Chemicals put some thought into the syringe design, eliminating the rubber seal and significantly reducing the pressure required to dispense the paste. My thumb gets very sore after pasting a lot of boards with EP256, but with this paste it is a breeze.
-The paste flows easily onto the board while maintaining a good tack to hold your parts in place during reflow. A lot of the Chinese pastes are easy to dispense, but they aren't tacky enough to hold the smaller parts in place during reflow. Kester EP256 is tacky enough, but is difficult to place on the boards when the temperature dips down below 70F. Once you warm up the boards and the paste a bit, the EP256 isn't too bad, but this paste is much easier to place.
The only downside is the smell. The solvent used is quite pungent, so if you're sensitive to strong chemical smells, I would stay away from this paste and instead go with the Kester EP256, which does not have a strong chemical smell and actually smells quite sweet when reflowing; however, I suspect that it is this pungent cocktail that makes this paste easier to use under non-ideal conditions.
If you work in non-ideal conditions (temperature, fresh tube of solder paste, etc.), and can handle the strong smell, this is the best paste out there.
When I first bought this I had a lot of trouble applying it to the very small circuits I was designing. Apparently you are supposed to buy special applicators, but it was my first time using solder paste and I had no idea. This led me to invent a very unconventional but surprisingly effective solution: fastening a spare 3D printing nozzle with tape to the end of the syringe and using it to apply tiny dots of paste just where I needed. Using this method I have soldered components as small as 0402 with ease.
As for baking the circuits, you really don't need to worry about temperature profiles and precision if you are just doing this as a hobby. I simply put solder where I need it, place the parts making sure they are well aligned, and throw it in the toaster oven on the "Broil" setting until all the solder has melted and is shiny. I have made several circuits this way and never had any problems.
To summarize, if you are thinking about getting in to reflow soldering, GO FOR IT! It's hard to get it wrong, and it's so much faster/funner/easier than doing everything by hand. I can't even imagine going back to through hole at this point.
Fortunately, MG Chemicals delivers the goods once again with this No Clean solder paste (the "No Clean" refers to the type of flux, which remains non-corrosive and non-conductive after soldering). It is easy to dispense and spreads well across a stainless steel stencil. It is also fairly easy to dispense directly to each pad through a 22ga. blunt needle.
Even better is that it seems to tolerate real-world toaster oven reflowing. I have a modified toaster oven that uses a proper industrial PID temperature controller with a thermocouple that is pressed against the board to control actual board temperature, but in the pursuit of laziness I tried "open loop" reflowing of a non-critical test board by setting the toaster oven to "toast" and letting it rip up until the temperature hit 170C, then I dialed back the thermostat knob and let it dwell there for 30 seconds, then cranked the thermostat back up until the temp hit 225C then dialed it back once again and cracked the door just a tad after about 5 seconds at 225-ish. Surprisingly, there wasn't a single cold/failed joint and they all passed vibration testing. Attached is a picture of a portion of a board that was soldered using this commando process and the MG Chemicals paste.