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About Rick Sturdivant
Ph.D. Colorado State University
M.A. Biola University
M.S. Univ. of Calif., Los Angeles
B.S. Calif. State Univ., Long Beach
B.A. Vanguard University
Patents and Articles:
Dr. Sturdivant holds seven U.S. patents and has five pending. He has published 54 journal and conference articles on engineering of systems and components. He has also author several books and book chapters.
Dr. Sturdivant founded MPT, Inc in 2003 and currently serves as its CTO. MPT provides products and services for phased arrays used in radar and communication systems as well as support components such as beam forming networks, high power amplifiers, low noise amplifiers, up/down converters, and digital receivers. He has taught engineering courses at Azusa Pacific University and Cal Poly Pomona.
He worked at Hughes Aircraft Company and then Raytheon Systems developing radar system components and modules. He designed the world's first radar Tile Array Module for which he was awarded the Engineering Excellence Award by Hughes Aircraft Company. He then worked for Multilink Corporation and helped grow the company to its public offering in 2002. At Multilink, he was instrumental in developing the world's first Ball Grid Array (BGA) modulator driver (Mach-zehnder) at 12.5Gb/S. Since 2003, he has started several successful technology companies that provide products and services in the radio frequency and wireless markets.
Dr. Sturdivant regularly presents at conference workshops and other venues. For several years he has been a guest lecturer for a course on T/R Modules for Phased Array Radar at Georgia Tech Research Institute. In addition, he has been an invited speaker to IEEE local chapters such as the local MTT-S chapter in San Diego, CA and the joint MTT-S and AP-S in Baltimore, MD. He has also taught professional development courses in the U.S. and Asia.
Rick has been married for 30 years and is the father of a daughter and son. He is an amateur radio operator and enjoys astronomy and fly fishing.
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Using practical examples, this book helps solve problems often encountered by technical professionals. Thermal management challenges, antenna element design issues, and architectures solutions are explored as well as the benefits and challenges of digital beam forming. This book provides the information required to train engineers to design and develop phased arrays and contains questions at the end of each chapter that professors will find useful for instruction.
The booklet starts out in Chapter 1 with an introduction to heat transfer. It describes why heat transfer is important and the mechanism of heat transfer. We describe why the book focuses on conduction. We then discuss Fourier’s heat conduction equation and how it applies to the analysis of electronic components.
Chapter 2 shows how to calculate heat dissipation in amplifiers. This is important since most microwave and millimeter-wave products use amplifiers which dissipate the majority of the power. We show a hands-on example of heat dissipation from a two amplifier transmit module. We also review power added efficiency and duty cycle.
Chapter 3 describes compact and straight forward methods to determine the junction temperature in electronic devices. This is important since the junction temperature determines the long term reliability. We show how to calculate the temperature rise in the electronic packaging.
Chapter 4 presents the five steps to success with commercial FEM thermal modeling. It shows modeling the electronic device, creating a 3D model assembly, creating a successful mesh, setting boundary conditions, and running the thermal simulation.
Chapter 5 shows how to create an equivalent thermal network and use electric circuit simulators for the solution. It also describes the 1-D heat transfer equation. The chapter focuses on the real world analysis of a package fabricated in HTCC alumina and shows how to analyze the metal layers and internal vias to predict the thermal resistance of the stack.
Chapter 6 outlines how to perform reliability calculations based upon heat transfer results. This is important since one of the main purposes of heat transfer analysis in electronics is to ensure long term reliability. We describe accelerated life testing, activation energy, mean time to failure (MTTF), and industry standards used in accelerated life testing.
Chapter 7 concludes the book with a short review of the topics discussed.
If you are looking to expand your knowledge of heat transfer analysis or are looking for a reference that will provide the knowledge needed for heat transfer of microwave and millimeter-wave electronics, then this book will be a welcome addition for you.
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
This book provides engineers and researchers with practical designs and 44 examples of analysis, circuits, and components used in T/R modules. It also provides a solid explanation of the theory for how T/R modules operate and how they can be optimized. In addition, this book shows how the latest technical advances in silicon germanium (SiGe) and gallium nitride (GaN) are allowing levels of performance that were previously unachievable. The book concludes with informative chapters on testing, cost considerations, and the future of next generation T/R modules.
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.