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Testing Semiconductor Memories: Theory and Practice

5.0 out of 5 stars 1 customer review
ISBN-13: 978-0471925866
ISBN-10: 0471925861
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Editorial Reviews

From the Publisher

As the size and density of semiconductor memories are increasing rapidly, testing them is becoming a major concern. This book tries to bring order to the vast amount of material published in the field by introducing a framework for ordering fault models and covering those test algorithms which are considered most efficient for finding the faults of each fault model. It presents memory test problems on the chip, array and board level, introducing fault models and tests for them at each of those levels.

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Product Details

  • Hardcover: 512 pages
  • Publisher: John Wiley & Sons Inc (September 1998)
  • Language: English
  • ISBN-10: 0471925861
  • ISBN-13: 978-0471925866
  • Product Dimensions: 1.2 x 7.8 x 9.5 inches
  • Shipping Weight: 2.4 pounds
  • Average Customer Review: 5.0 out of 5 stars  See all reviews (1 customer review)
  • Amazon Best Sellers Rank: #1,708,436 in Books (See Top 100 in Books)

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Format: Paperback
Over 30% of today's designs implements embedded memories and continuously consumes more and more die area. While embedded memory presents significant system performance and cost reduction advantages, it brings its own testing issues. Test vector style tests are not suitable for verifying embedded memory arrays because it is too costly. This is because the time spent in the manufacturing tester grows exponentially as the embedded memory die area increases. Sometimes it is impossible to create a set of vectors that can detect all possible types of memory defect.
Implementing embedded memory built in self-test (BIST) can alleviate these problems. In simplistic terms, memory BIST is an on-chip utility that enables the execution of a proven set of algorithmic style verification tests directly on the memory array. These tests can be executed at the design's full operating frequency to prove the memory array operations and identify errors caused by silicon defects.
Embedded memories are the most dense components within a system-on-chip (SOC), accounting for up to 90% of its real estate.1 Memories also are the most sensitive to process defects, making it essential to thoroughly test them in the SOCs.
Because memories are used as test vehicles for monitoring the silicon process and improving its yield, extracting additional diagnostic data to determine the causes of failures now is required in the testing strategy. In addition to diagnosis, many embedded memories are designed with built-in redundancy, which provides spare rows and columns that can replace failing locations. Redundancy enables the manufacturer to repair a number of otherwise defective devices to ensure maximum production yield.
Characteristics of today's SOC designs include the following:
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