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Spice Based Heat Transport Model for Non-Intrusive Thermal Diagnostic Applications Paperback – August 17, 2005
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Heat Transport Model for Non-intrusive Thermal Diagnostic Applications, by Michael A. Stelzer, Ph.D.
Michael A. Stelzer, Ph.D., gives an impressively detailed look at the equivalence between the thermal system of equations and the variables of circuit theory. He uses this similarity, together with SPICE (Simulation Program with Integrated Circuits Emphasis), to accurately model heat flow with traditional methods in electrical engineering. Originally Dr. Stelzer's thesis, the book details the computational complexity of heat flow and why an electrical analogue to the thermal system improves the efficiency and computational speed of the solutions.
The work also successfully carries out the following tasks: (a) Demonstrates that clear differences exist in the results of simulated heat flow between pure samples and those containing defects and/or cracks. (b) Identifies the parameters that can best carry information on the defects. (Dr. Stelzer points out these are time-delays and magnitudes of the local temperature in response to a laser-generated heat span.) (c) Shows a test example of a SPICE-based method for irrefutable demonstration. Additionally, the research points out that an error of less than 5% exists between the SPICE results and those of an exact thermal solution. Packed with over 80 figures and tables, the book thoroughly verifies Dr. Stelzers' ideas and conclusions.
About the Author
Michael A. Stelzer, Ph.D., is a three time author, a champion competitor in martial arts, and a distinguished engineer. He received a doctorate in electrical engineering in June 2005. In addition to speaking several languages he is a U.S. Navy veteran. His other books include Mental Mathematics and Learn a Language Your Own Way.